Electronic?photonic board as an integration platform for Tb/s multi?chip optical communication

نویسندگان

چکیده

Chip-on-board silicon photonics O-band wavelength-division multiplexing transceivers have been developed that will eventually enable high-throughput on-board optical communication for multi-socket communication. This direct, any-to-any configuration yields low-latency, low-power among multiple compute nodes on the board. Silicon photonic transceiver chips are flip-chipped a polymer waveguide containing an electro-optical circuit board using adiabatic coupling and then completed with driver amplifier electronic chips. A assembly based wire-bond technology verifies 50 Gb/s operation per channel, flip-chip version demonstrates chip techniques compact transceivers.

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ژورنال

عنوان ژورنال: Iet Optoelectronics

سال: 2021

ISSN: ['1751-8776', '1751-8768']

DOI: https://doi.org/10.1049/ote2.12017